Material Specification for La:21; [La(Sr)-Cu-O]
Process: Solid State Reaction
Notes: The authors cite C. Uher et al., Phys. Rev. B, Vol. 36, 5676 (1987), and summarize the procedure as follows. "Specimens of nominal Sr content x = 0.10, 0.20, and 0.25 were cut from discs with a diamond saw into parallelepipeds of typical dimensions 0.20 x 0.20 x 1.5 cm3." No additional processing details were noted.
Formula: La2-xSrxCuO4-y
Informal Name: La:21
Chemical Family: La(Sr)-Cu-O
Chemical Class: Oxide
Structure Type: Polycrystalline
Manufacturer: In House
Commercial Name: In House
Production Date:
Lot Number:
Production Form:
Critical Temperature for La:21; [La(Sr)-Cu-O]
x of Srx (formula units) |
Critical Temperature (K) |
0.1 |
0 |
0.2 |
30 |
0.25 |
15 |
Measurement Method: Electrical resistance
Cautions: Unevaluated Data
No measurement details were noted.
Thermal Conductivity for La:21; [La(Sr)-Cu-O]
x of Srx (formula units) |
Temperature (K) |
Thermal Conductivity (W m-1 K-1) |
0.10 |
0.15 |
0.00008 |
0.10 |
0.29 |
0.0004 |
0.10 |
0.58 |
0.002 |
0.10 |
1.2 |
0.010 |
0.10 |
1.9 |
0.025 |
0.10 |
2.4 |
0.055 |
0.10 |
3.5 |
0.091 |
0.10 |
3.6 |
0.11 |
0.10 |
4.2 |
0.13 |
0.10 |
5.0 |
0.22 |
0.10 |
6.5 |
0.31 |
0.10 |
10.2 |
0.46 |
0.10 |
14.6 |
0.75 |
0.20 |
0.11 |
0.00045 |
0.20 |
0.12 |
0.00051 |
0.20 |
0.14 |
0.00054 |
0.20 |
0.16 |
0.00067 |
0.20 |
0.18 |
0.00075 |
0.20 |
0.48 |
0.0027 |
0.20 |
0.61 |
0.0045 |
0.20 |
1.2 |
0.012 |
0.20 |
2.9 |
0.052 |
0.20 |
6.2 |
0.17 |
0.20 |
8.9 |
0.28 |
0.20 |
10.6 |
0.38 |
0.20 |
14.6 |
0.60 |
0.25 |
0.13 |
0.0011 |
0.25 |
0.21 |
0.0016 |
0.25 |
0.58 |
0.0070 |
0.25 |
1.4 |
0.033 |
0.25 |
2.4 |
0.10 |
0.25 |
3.2 |
0.15 |
0.25 |
6.0 |
0.37 |
0.25 |
7.8 |
0.45 |
0.25 |
14.6 |
0.75 |
Measurement Method: Steady-state method
"Thermal conductivity was measured in a dilution refrigerator using a steady-state technique with two calibrated germanium thermometers." No additional measurement details were noted.
Cautions: Evaluated Data
Digitized data were obtained from Figure 2 of the paper.