Material Specification for Y:123; [Y-Ba-Cu-O]
Process:
Notes:
Formula: YBa2Cu3Ox
Informal Name: Y:123
Chemical Family: Y-Ba-Cu-O
Chemical Class: Oxide
Structure Type:
Manufacturer:
Commercial Name:
Production Date:
Lot Number: FNTY-1
Production Form: Thin Film
Critical Temperature for Y:123; [Y-Ba-Cu-O]
Tc(on) (K) |
Tc(mid) (K) |
Critical Temperature (K) |
89.0 |
86.0 |
80.0 |
Measurement Method: Resistivity (DC 4-probe)
Test facility: Lab. of General Electronics, Dept. of Electronic Engineering, Faculty of Engineering, Tohoku University
Location: Rm. 217, Electronics & Information Bldg., Faculty of Engineering, Tohoku University
Start date: 3/1/94
End date: 3/1/94
Environment temperature (avg): 23 °C
Environment humidity (avg): 40 %
Remark on lab. environment: humidity after test: 44 %
Laboratory environment: air conditioned
Test equipment (1): multimeter
Maker of test equipment (1): Hewlett Packard
Model of test equipment (1): HP3457A
Remark on test equipment (1): for measurement of probe and thermometer voltages
Test equipment (2): digital multimeter
Maker of test equipment (2): Hewlett Packard
Model of test equipment (2): HP3465B
Remark on test equipment (2): Si thermometer, current monitor
Test equipment (3): digital multimeter
Maker of test equipment (3): Advantest
Model of test equipment (3): TR6841
Remark on test equipment (3): for monitoring sample current
Test equipment (4): digital multimeter
Maker of test equipment (4): Advantest
Model of test equipment (4): R6551
Test equipment (5): Pt thermometer, current monitor
Maker of test equipment (5): Yokokawa Denki
Model of test equipment (5): YEW TYPE 2555
Test equipment (6): DC current source
Maker of test equipment (6): Tama Denki Kogyo
Model of test equipment (6): SDT-101A
Specimen history: stored in desiccator
Specimen size - width of thin film: 1.9 mm
Specimen size - length of thin film: 8.85 mm
Distance between current electrodes: 8 mm
Distance between voltage electrode: 3 mm
Specimen pre-treatment: coating Au to probes by ion sputter HFC-1100 (JEOL) (discharge power: 1200 V x 7 mA, time: 5 min, film thickness: 400 σ), soldering 0.1 mm diameter Cu wire with In, surrounding holder with Cu block, setting the probes on the holder by soldering
Test environment: one end of sample cooled into temperature of liquid He, lifted the sample from liquid He surface, temperature increased naturally
Test temperature (min): 4.2 K
Test temperature (max): 120 K
Applied current (avg): 0.165 mA
Applied voltage (min): 3 mV
Applied voltage (max): 4 mV
Test condition: measuring resistances at 300K, 77K, and 4.2K
Remark on test condition: temperature monitored by a Si-diode thermometer and a Pt resistance thermometer (current: 10 µA and 100 µA respectively)
Data output type: sample probe voltage and thermometer voltage, data transferred from HP3457A to PC9801F by GP-IB line, temperature and the measured data saved in floppy disk
Data comment (1): plotting and printing the saved data, then determining the dada value with eyes
Data comment (2): measuring thermometer voltages before and after measuring sample probe voltage, taking the average as thermometer voltage
Data comment (3): converting thermometer voltage into temperature by a program based on thermometer correction data and complementary method
Cautions: Research Data