NIST High Temp. Superconducting Materials (HTS) Database:

NIST Standard Reference Database 62

Last Update to Data Content: 1996

DOI: https://doi.org/10.18434/T4KP8J


Bibliographic Information

Title: Low Surface Resistance YBCO Thick Films
Author(s): N.M. Alford, T.W. Button, and D. Opie
Publication: Superconductor Science and Technology Volume: 4 Issue: Not Available Year: 1991 Page(s): 433-435
Editor(s): Not Available
Publisher: IOP Publishing Ltd
Language: English
Notes: Not Available
Keywords: Material Specification, Surface Resistance

Materials and Properties

Y:123; [Y-Ba-Cu-O]
Material Specification for Y:123; [Y-Ba-Cu-O] Process: Doctor Blade
Notes: The authors cite T.W. Button et al., 1991 IEEE Trans. Magn., Vol. 27, 1434 (1991), and summarize the procedure as follows. "YBCO powder was mixed with nonaqueous polymers and solvent using a three-roll mill. The resulting ink was screen printed or doctor bladed onto suitable substrates... The thick film is fired at temperatures between 950 °C and 1050 °C and slowly cooled under oxygen."
Formula: YBa2Cu3Ox
Informal Name: Y:123
Chemical Family: Y-Ba-Cu-O
Chemical Class: Oxide
Structure Type:
Manufacturer: In House
Commercial Name: In House
Production Date:
Lot Number:
Production Form: Thick Film

Surface Resistance for Y:123; [Y-Ba-Cu-O]
Magnetic Field (A/m) Temperature (K) Surface Resistance (mΩ)
6207 16 5.2
6207 19 4.6
6207 20 4.9
6207 25 4.3
6207 29 5.6
6207 35 5.6
6207 41 6.7
6207 44 5.9
6207 46 7.2
6207 50 8.1
6207 54 8.1
6207 57 7.0
6207 60 8.1
6207 66 8.6
6207 80 14.3
6207 84 23.8
6207 86 173.0
6207 89 662.2
6207 91 911.2
0 17 1.8
0 21 1.6
0 29 2.5
0 33 2.3
0 36 3.2
0 40 2.6
0 49 3.9
0 51 3.4
0 57 4.1
0 61 3.2
0 67 3.9
0 69 3.1
0 73 4.7
0 80 8.0
0 83 14.4
0 85 79.8
0 87 362.2
0 89 909.2
0 93 969.9
Measurement Method: Microwave absorption
"The Rc of the films was measured on a HP 8720 vector network analyser using... the endplate replacement technique using a copper TE011 cavity."

Cautions: Evaluated Data
Data were digitized from Figure 2 of the paper.