NIST Standard Reference Database 30
Last Update to Data Content: 2002
"Effects of Elemental Additives on Densification, Microstructure, Strength, and Thermal Conductivity of Silicon Carbide Ceramics," Y. Takeda, K. Nakamura, K. Maeda, and M. Ura, Advanced Ceramic Materials, Vol. 1 [2], pp. 162-165 (1986), published by American Ceramic Society.Language: English
"About 35 g of SiC powder (Fujimi Abrasive Co., Ltd., Aichi, Japan), 1 wt% additives, 3.5 mL silicone oil, and 3.5 mL xylene were put into an alumina bottle and mixed using an alumina mortar and pestle for 1 h. ... The mixed composites were pressed with a carbon-steel die (50 mm inner diameter) at a load of 100 MPa. After the mixtures were cold-pressed, the green body had a density of 1.71 g/cm3 to 1.73 g/cm3 ... After the green body was set in a graphite die, the chamber of the hot pressing furnace was evacuated to 1mPa to 10 mPa, and the sample was pressed at 20 MPa. The graphite die was heated inductively to 2040 °C during a 100 min period and then held for 1 h." The sintering aids (mass fraction of 1 %) were (Material #1, Al), (Material #2, B), and (Material #3, Be).
The measurements were made "by a laser-flash method at 25 °C. With this method, the specific heat and thermal diffusivity could be obtained. The thermal conductivity, K, was calculated from: K = qCpd where q = thermal diffusivity, Cp = specific heat, and d = density. Samples were 10 mm in diameter and 2-5 mm thick." However, no values of q or Cp were noted.Three-point bend test
The measurements were made by a three-point bend method. Flexural strength samples were machined to 2 mm x 2 mm x 50 mm on a metal-bonded diamond wheel. All surfaces were polished with 2 µm resin-bonded diamond disk to a surface roughness of 0.1 µm. Tests were conducted using a DSS-5000 (Shimazu Ltd., Japan) tester with a crosshead speed of 2 mm/min and a span of 30 mm in air at 25 °C.
| Amount of Element ( formula units ) |
Element ( no unit ) |
|---|---|
| 1 | Si |
| 1 | C |
| Density ( g cm-3 ) |
|---|
| 3.18 |
| Temperature ( °C ) |
Flexural Strength ( MPa ) |
|---|---|
| 25 | 940 |
| Temperature ( °C ) |
Thermal Conductivity ( W m-1 K-1 ) |
|---|---|
| 25 | 60 |
| Amount of Element ( formula units ) |
Element ( no unit ) |
|---|---|
| 1 | Si |
| 1 | C |
| Density ( g cm-3 ) |
|---|
| 3.18 |
| Temperature ( °C ) |
Flexural Strength ( MPa ) |
|---|---|
| 25 | 290 |
| Temperature ( °C ) |
Thermal Conductivity ( W m-1 K-1 ) |
|---|---|
| 25 | 170 |
| Amount of Element ( formula units ) |
Element ( no unit ) |
|---|---|
| 1 | Si |
| 1 | C |
| Density ( g cm-3 ) |
|---|
| 3.15 |
| Temperature ( °C ) |
Flexural Strength ( MPa ) |
|---|---|
| 25 | 400 |
| Temperature ( °C ) |
Thermal Conductivity ( W m-1 K-1 ) |
|---|---|
| 25 | 260 |