Reliable (reported energy within 300 eV of a reference energy)
Comment:
The GaAs(110) wafer was initially degreased and wet etched in H2SO4:H2O2:H2O (5:1:1). The surface oxide was removed in situ by annealing (T = ~ 825 K, time > 20 min). Emission angle = 50 degrees. Branching ratio = 0.68.