Reliable (reported energy within 300 eV of a reference energy)
Comment:
The GaAs(110) wafer was initially degreased and wet etched in H2SO4:H2O2:H2O (5:1:1). The surface oxide was removed in situ by Ar+ ion bombardment (Ep = 3 keV, j = 1E15 ions/cm2) and annealing. Emission angle = 50 degrees.